Bay Photonics

bay photonics are experts in photonic integrated circuit (pic) packaging for proof of concept, prototyping and production, using our extensive knowledge of semiconductor and laser/led assembly for design, development, design for manufacture (dfm), production method and test (dft). we offer both design consultancy and bespoke assembly/packaging services to achieve the customer’s goal. the team can assist with new product introduction (npi) engineering as product line volume grows and offer services to help transfer to manufacturing facilities within the uk or to offshore contract electronic manufacturers and company subsidiaries. the founders and senior engineers all have in depth experience with fibre optic assembly and die packaging from their careers with stc, nortel and bookham. our facilities include a class 1000 cleanroom and our equipment list continues to expand to meet new and future customer demands and currently includes: manual die bonding, manual and auto gold and aluminium