Beijing Gin Koo Mems Scientific & Technological Co., Ltd. 北京金库铭微科技有限公司

北京金库铭微科技有限公司成立于2013年，公司是国内尖端硬脆材料精密微结构加工和室温晶圆键合产品代工和设备供应商，产品广泛应用于集成电路、半导体照明、微机电系统、先进封装、光通信、生物医药等领域，我们可以在玻璃、石英、硅、压电材料、陶瓷等硬脆材料表面加工微米级钻孔，切割，几何图形加工，2.5d结构加工，能实现纳米级抛光,室温键合技术可实现玻璃－玻璃、玻璃－硅、石英－石英、蓝宝石－蓝宝石和陶瓷气密性封装和晶圆级封装，我司销售设备有微细铣削（micro milling)、sace、玻璃激光焊接等微加工设备。 founded in 2013, beijing ginkoo mems is a domestic high-end equipment and process service provider for precision micro-structure machining of hard and brittle materials and room temperature wafer bonding. products are for various applications such as semiconductor, led, mems, advanced packaging, optical communication, medical industry, etc. we can do micro-level drilling, cutting, geometry machining, 2.5d micro-structuring and nano-level polishing on hard and brittle materials including glass, quartz, silicon, ceramics and piezoelectric material. our room temperature bonding technology is suited for glass-glass, glass-silicon, quartz-quartz, sapphire-sapphire and ceramics hermetic encapsulation and wlp.