Jcet Group Co., Ltd.

jcet group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, r&d, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive and industry etc., through advanced wafer level packaging, 2.5d/3d, system-in-packaging, and reliable flip chip and wire bonding technologies. jcet group has three r&d centers, six manufacturing locations in china, singapore and korea, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to customers in china and around the world.